Micron MT36KSF2G72PZ-1G6E1 Datenblatt

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DDR4 SDRAM RDIMM
MTA36ASF2G72PZ – 16GB
Features
DDR4 functionality and operations supported as
defined in the component data sheet
288-pin, registered dual in-line memory module
(RDIMM)
Fast data transfer rates: PC4-2400 or PC4-2133
16GB (2 Gig x 72)
V
DD
= 1.20V (NOM)
V
PP
= 2.5V (NOM)
V
DDSPD
= 2.5V (NOM)
Supports ECC error detection and correction
Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
Low-power auto self refresh (LPASR)
On-die V
REFDQ
generation and calibration
Dual-rank
On-board I
2
C temperature sensor with integrated
serial presence-detect (SPD) EEPROM
16 internal banks; 4 groups of 4 banks each
Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
Selectable BC4 or BL8 on-the-fly (OTF)
Gold edge contacts
Halogen-free
Fly-by topology
Terminated control, command, and address bus
Figure 1: 288-Pin RDIMM (MO-309, R/C-B)
Module height: 31.25mm (1.23in)
Options Marking
Operating temperature
Commercial (0°C T
OPER
95°C) None
Package
288-pin DIMM (halogen-free) Z
Frequency/CAS latency
0.83ns @ CL = 17(DDR4-2400) -2G3
0.93ns @ CL = 15 (DDR4-2133) -2G1
Table 1: Key Timing Parameters
Speed
Grade
Industry
Nomen-
clature
Data Rate (MT/s)
t
RCD
(ns)
t
RP
(ns)
t
RC
(ns)
CL =
20,
CL =
19
CL =
18
CL =
17
CL =
16
CL =
15
CL =
14
CL =
13
CL =
12
CL =
11
CL =
10 CL = 9
-2G6 PC4-2666 2666 2666 2400 2133 2133 1866 1866 1600 1333 14.16 14.16 46.16
-2G4 PC4-2400 2400 2400 2400 2133 1866 1866 1600 1600 1333 13.32 13.32 45.32
-2G3 PC4-2400 2400 2400 2133 2133 1866 1866 1600 1600 1333 14.16 14.16 46.16
-2G1 PC4-2133 2133 2133 1866 1866 1600 1600 1333 13.5 13.5 46.5
16GB (x72, ECC, DR) 288-Pin DDR4 RDIMM
Features
PDF: 09005aef84f8c349
asf36c2gx72pz.pdf - Rev. F 2/15 EN
1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2012 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
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Inhaltsverzeichnis

Seite 1 - DDR4 SDRAM RDIMM

DDR4 SDRAM RDIMMMTA36ASF2G72PZ – 16GBFeatures• DDR4 functionality and operations supported asdefined in the component data sheet• 288-pin, registered

Seite 2 - Features

Table 7: Component-to-Module DQ Map Back (Continued)ComponentReferenceNumberComponentDQ Module DQModule PinNumberComponentReferenceNumberComponentDQ M

Seite 3 - Pin Assignments

Functional Block DiagramFigure 2: Functional Block DiagramDQ DQ DQ DQ ZQDQ0 DQ1 DQ2 DQ3 VssDQ DQ DQ DQU1U29DQ DQ DQ DQ ZQDQ4 DQ5 DQ6 DQ7 VssDQ DQ DQ D

Seite 4

General DescriptionHigh-speed DDR4 SDRAM modules use DDR4 SDRAM devices with two or four internalmemory bank groups. DDR4 SDRAM modules utilizing 4- a

Seite 5 - Pin Descriptions

Address Mapping to DRAMAddress MirroringTo achieve optimum routing of the address bus on DDR4 multi rank modules, the ad-dress bus will be wired as sh

Seite 6

To reduce the electrical load on the host memory controller's command, address, andcontrol bus, Micron's RDIMMs utilize a DDR4 registering c

Seite 7

Temperature Sensor With SPD EEPROM OperationThermal Sensor OperationsThe integrated thermal sensor continuously monitors the temperature of the module

Seite 8

Electrical SpecificationsStresses greater than those listed may cause permanent damage to the module. This is astress rating only, and functional oper

Seite 9

Table 11: Thermal CharacteristicsSymbol Parameter/Condition Value Units NotesTCCommercial operating case temperature 0 to 85 °C 1, 2, 3>85 to 95 °C

Seite 10 - PDF: 09005aef84f8c349

DRAM Operating ConditionsRecommended AC operating conditions are given in the DDR4 component data sheets.Component specifications are available at mic

Seite 11 - Functional Block Diagram

IDD SpecificationsTable 13: DDR4 IDD Specifications and Conditions – 16GB (Die Revision A)Values are for the MT40A1G4 DDR4 SDRAM only and are computed

Seite 12 - General Description

Table 2: AddressingParameter 16GBRow address 64K A[15:0]Column address 1K A[9:0]Device bank group address 4 BG[1:0]Device bank address per group 4 BA[

Seite 13 - Address Mapping to DRAM

Registering Clock Driver SpecificationsTable 14: Registering Clock Driver Electrical CharacteristicsDDR4 RCD01 devices or equivalentParameter Symbol P

Seite 14 - Rank Addressing

Temperature Sensor With SPD EEPROMThe temperature sensor continuously monitors the module's temperature and can beread back at any time over the

Seite 15 - Thermal Sensor Operations

Module DimensionsFigure 3: 288-Pin DDR4 RDIMM31.40 (1.236)31.10 (1.224)2.50 (0.098) D(2X)0.75 (0.03) R(8X)Front view133.48 (5.255)133.22 (5.244)Back v

Seite 16 - Electrical Specifications

Pin AssignmentsThe pin assignment table below is a comprehensive list of all possible pin assignmentsfor DDR4 RDIMM modules. See Functional Block Diag

Seite 17

Table 4: Pin Assignments (Continued)288-Pin DDR4 RDIMM Front 288-Pin DDR4 RDIMM BackPin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol

Seite 18 - DRAM Operating Conditions

Pin DescriptionsThe pin description table below is a comprehensive list of all possible pins for DDR4modules. All pins listed may not be supported on

Seite 19 - Specifications

Table 5: Pin Descriptions (Continued)Symbol Type DescriptionODTx Input On-die termination: ODT (registered HIGH) enables termination resistance intern

Seite 20

Table 5: Pin Descriptions (Continued)Symbol Type DescriptionTDQS_tTDQS_c(x8 DRAM-basedRDIMM only)Output Termination data strobe: When enabled via the

Seite 21 - SPD Data

DQ MapTable 6: Component-to-Module DQ Map FrontComponentReferenceNumberComponentDQ Module DQModule PinNumberComponentReferenceNumberComponentDQ Module

Seite 22 - Module Dimensions

Table 6: Component-to-Module DQ Map Front (Continued)ComponentReferenceNumberComponentDQ Module DQModule PinNumberComponentReferenceNumberComponentDQ

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