Micron MT36KSF2G72PZ-1G6E1 Datenblatt PDF herunterladen (Seite 18)

DRAM Operating Conditions

Recommended AC operating conditions are given in the DDR4 component data sheets.

Component specifications are available at micron.com. Module speed grades correlate

with component speed grades, as shown below.

Table 12: Module and Component Speed Grades

DDR4 components may exceed the listed module speed grades; module may not be available in all listed speed grades

Module Speed Grade Component Speed Grade

-2G6 -075

-2G4 -083E

-2G3 -083

-2G1 -093E

-1G9 -107E

Design Considerations

Simulations

Micron memory modules are designed to optimize signal integrity through carefully de-

signed terminations, controlled board impedances, routing topologies, trace length

matching, and decoupling. However, good signal integrity starts at the system level. Mi-

cron encourages designers to simulate the signal characteristics of the system's memo-

ry bus to ensure adequate signal integrity of the entire memory system.

Power

Operating voltages are specified at the edge connector of the module, not at the DRAM.

Designers must account for any system voltage drops at anticipated power levels to en-

sure the required supply voltage is maintained.

16GB (x72, ECC, DR) 288-Pin DDR4 RDIMM

DRAM Operating Conditions

PDF: 09005aef84f8c349

asf36c2gx72pz.pdf - Rev. F 2/15 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

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Micron MT36KSF2G72PZ-1G6E1 Datenblatt Seite 18